This scientific and technical day is dedicated to molecular bonding, adhesion and its reinforcement by surface preparation and treatment of assemblies. Silica remains the best understood material with the most mature molecular bonding. The day will also address other materials for different application areas.

Infra-Red film of wavefront propagation of direct bonfding between 2 silicium wafers of 300 mm diameter coated with thermal SiO2 (crédit CEA Leti, F. Fournel) 

It follows on from the 2019 event, which led to the creation of a "molecular adhesion" working group supported by the ROP and organiser of this 2023 event. It will present the state of the art on this bonding process and show work carried out in recent years using this technology.

This theme day is co-organised by the Laboratoire de Mécanique et d'Acoustique (LMA), the Réseau Optique et Photonique (ROP), the Cristaux Micro-nano-structures et Dispositifs pour l'Optique (CMDO+) network and supported by the Mission pour les Initiatives Transverses et Interdisciplinaires of the CNRS and the Comunauté d'ExperT Optique et OptoElectronique (COMET-OEE) of the CNES.